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soldering paste Solder Flux Paste BGA SMD Soldering Flux Paste Syringe Convenient Tube

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Solder Flux Paste BGA SMD Soldering Flux

  • Maximum Temperature: 200 degree C
  • Pack of: 1

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printing solder paste in and over the holes. The sticky paste temporarily holds components in place; the board is then heated, melting the paste and forming a mechanical bond as well as an electrical connection.

The paste is applied to the board by jet printing, stencil printing or syringe, then the components are put in place by a pick-and-place machine or by hand.

Weight 2.1 kg
Dimensions 122 × 145 × 321 cm

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