Solder Flux Paste BGA SMD Soldering Flux
printing solder paste in and over the holes. The sticky paste temporarily holds components in place; the board is then heated, melting the paste and forming a mechanical bond as well as an electrical connection.
The paste is applied to the board by jet printing, stencil printing or syringe, then the components are put in place by a pick-and-place machine or by hand.
Weight | 2.1 kg |
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Dimensions | 122 × 145 × 321 cm |